From: Adrian Szyndela <adrian.s@samsung.com>
Date: Wed, 16 Feb 2022 22:02:34 +0000 (+0100)
Subject: packaging: bump version to 0.21.0
X-Git-Tag: submit/tizen/20220217.092523~1
X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=046aac400387511d98643a5bd9ceef2ccd036371;p=platform%2Fupstream%2Fbcc.git

packaging: bump version to 0.21.0

Change-Id: I40efa640a63c6ff91d56ac5f2e6ce42879ae4a55
---

diff --git a/packaging/bcc-tools.spec b/packaging/bcc-tools.spec
index 1752fd98..c8fd7b4f 100644
--- a/packaging/bcc-tools.spec
+++ b/packaging/bcc-tools.spec
@@ -1,5 +1,5 @@
 Name: bcc-tools
-Version: 0.3.0
+Version: 0.21.0
 Release: 0
 Summary: Tools for BPF-based Linux IO analysis, networking, monitoring
 License: Apache-2.0