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Package version up to 3.0.7
58/307658/1
accepted/tizen_unified
tizen
accepted/tizen/unified/20240313.134345
accepted/tizen/unified/20240313.135506
author
Changyeon Lee
<cyeon.lee@samsung.com>
Tue, 12 Mar 2024 06:19:50 +0000
(15:19 +0900)
committer
Changyeon Lee
<cyeon.lee@samsung.com>
Tue, 12 Mar 2024 06:20:03 +0000
(15:20 +0900)
Change-Id: Ib324dde8bb09e45ec3fd1cb25a84d87ec5996cc5
packaging/hal-backend-tbm-vigs.spec
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a/packaging/hal-backend-tbm-vigs.spec
b/packaging/hal-backend-tbm-vigs.spec
index
4a189da
..
40b4da0
100644
(file)
--- a/
packaging/hal-backend-tbm-vigs.spec
+++ b/
packaging/hal-backend-tbm-vigs.spec
@@
-1,5
+1,5
@@
Name: hal-backend-tbm-vigs
-Version: 3.0.
6
+Version: 3.0.
7
Release: 1
License: MIT
Summary: hal tbm backend module for vigs