hal-backend-power: Fix wrong spell

Change-Id: I4b6b9c18309edd9e79f7d9156026fddc9f46f878
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>

diff --git a/src/hal-backend-power.c b/src/hal-backend-power.c
index c081d9e..4cbbdfb 100644 (file)
--- a/src/hal-backend-power.c
+++ b/src/hal-backend-power.c
@@ -28,7 +28,7 @@
 #define BUFF_MAX       255
 
 /*************************
- * H/W Resource Defintions
+ * H/W Resource Definitions
  */
 #define CPUFREQ_PATH_PREFIX                    "/sys/devices/system/cpu/"
 #define CPUFREQ_CURR_GOVERNOR_PATH_SUFFIX      "/cpufreq/scaling_governor"
@@ -273,10 +273,10 @@ static int cpu_tmu_get_temp(char *res_thermal_name)
 
        /*
         * Thermal framework provides the current temperature
-        * as five digits interger like 54430 when temperature is 54.430
+        * as five digits integer like 54430 when temperature is 54.430
         * degrees centigrade. But, Thermal Monitor in Tizen usually
-        * use two digits interger without decimal point.
-        * So that round temperature value. It constraints the maximume
+        * use two digits integer without decimal point.
+        * So that round temperature value. It constraints the maximum
         * temperature as 1049 degrees centigrade for preventing integer
         * overflow. Usually, the embedded device never over 1000 degrees
         * centigrade.