Package version up to 3.3.1 57/315957/2 accepted/tizen_9.0_unified accepted/tizen_unified_dev tizen_9.0 accepted/tizen/9.0/unified/20241030.232440 accepted/tizen/unified/20240902.161400 accepted/tizen/unified/dev/20240903.220351 tizen_9.0_m2_release
authorChangyeon Lee <cyeon.lee@samsung.com>
Wed, 7 Aug 2024 11:11:25 +0000 (20:11 +0900)
committerChangyeon Lee <cyeon.lee@samsung.com>
Mon, 12 Aug 2024 04:50:52 +0000 (13:50 +0900)
Change-Id: I174862307fb2428053fba506590cf16c9aeee313

packaging/hal-backend-tbm-vigs.spec

index 197ff4d9f2067acb0108e7629494e656c24333fd..ed7aaf45f2faf52bef6a68c165ebfa860fed7e36 100644 (file)
@@ -1,5 +1,5 @@
 Name:           hal-backend-tbm-vigs
-Version:        3.1.0
+Version:        3.1.1
 Release:        1
 License:        MIT
 Summary:        hal tbm backend module for vigs