Package version up to 3.3.2 24/319124/1 accepted/tizen_unified accepted/tizen_unified_x accepted/tizen_unified_x_asan tizen accepted/tizen/unified/20241030.154456 accepted/tizen/unified/x/20241218.081856 accepted/tizen/unified/x/asan/20241224.003604
authorjinbong.lee <jinbong.lee@samsung.com>
Tue, 15 Oct 2024 11:29:41 +0000 (20:29 +0900)
committerjinbong.lee <jinbong.lee@samsung.com>
Tue, 15 Oct 2024 11:29:41 +0000 (20:29 +0900)
Change-Id: Iaa9a59dd767927dbcbede22ce3b1840c82378c22

packaging/hal-backend-tbm-vigs.spec

index ed7aaf45f2faf52bef6a68c165ebfa860fed7e36..e77a43c6e23b760459041fb53aa9f1ef095f4f95 100644 (file)
@@ -1,5 +1,5 @@
 Name:           hal-backend-tbm-vigs
-Version:        3.1.1
+Version:        3.1.2
 Release:        1
 License:        MIT
 Summary:        hal tbm backend module for vigs