packaging: bump to 1.8.0
authorBoram Park <boram1288.park@samsung.com>
Fri, 6 Nov 2015 02:52:10 +0000 (11:52 +0900)
committerBoram Park <boram1288.park@samsung.com>
Fri, 6 Nov 2015 05:10:26 +0000 (14:10 +0900)
Change-Id: Ie2286efb95640e7e53ac962d061df0aee7467c16

packaging/weston.spec

index 91b4ea56031d07ccc3dbbef4c5a0b8a4ea3c413f..1623068abe05989b3ea2ef162daeeb0e9d27f86c 100644 (file)
@@ -28,7 +28,7 @@
 %endif
 
 Name:           weston
-Version:        1.7.0
+Version:        1.8.0
 Release:        0
 Summary:        Wayland Compositor Infrastructure
 License:        MIT