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packaging: Bump version
authorKarol Lewandowski <k.lewandowsk@samsung.com>
Fri, 24 Jan 2014 15:45:52 +0000 (16:45 +0100)
committerŁukasz Stelmach <l.stelmach@samsung.com>
Wed, 19 Nov 2014 12:46:10 +0000 (13:46 +0100)
packaging/kdbus-bus.spec patch | blob | history

diff --git a/packaging/kdbus-bus.spec b/packaging/kdbus-bus.spec
index ac3314728a052c1271a3bd2f25485dc6f21e9308..8a5a9d7cbe4d27623ca442132db97fea6a740e7c 100644 (file)
--- a/packaging/kdbus-bus.spec
+++ b/packaging/kdbus-bus.spec
@@ -1,6 +1,6 @@
 Name:       kdbus
 Summary:    kdbus kernel module
-Version:    0.4
+Version:    0.5
 Release:    1
 Group:      Base/Device Management
 License:    GPL-2.0
Domain: System / Uncategorized;