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packaging: Bump release
authorKarol Lewandowski <k.lewandowsk@samsung.com>
Fri, 24 Jan 2014 16:10:52 +0000 (17:10 +0100)
committerŁukasz Stelmach <l.stelmach@samsung.com>
Wed, 19 Nov 2014 12:46:10 +0000 (13:46 +0100)
packaging/kdbus.spec patch | blob | history

diff --git a/packaging/kdbus.spec b/packaging/kdbus.spec
index 727a59b7b5bc24532141ee5ba4581178846ef3a2..a011d3db15b28630c571c4b33ecfdb27b17f428f 100644 (file)
--- a/packaging/kdbus.spec
+++ b/packaging/kdbus.spec
@@ -1,7 +1,7 @@
 Name:       kdbus
 Summary:    kdbus kernel module
 Version:    0.5
-Release:    1
+Release:    2
 Group:      Base/Device Management
 License:    GPL-2.0
 Source0:    %{name}-%{version}.tar.gz
Domain: System / Uncategorized;