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packaging: Bump up to 1.13.1
97/303797/2
author
Jihoon Kim
<jihoon48.kim@samsung.com>
Fri, 5 Jan 2024 04:53:26 +0000
(13:53 +0900)
committer
Jihoon Kim
<jihoon48.kim@samsung.com>
Fri, 5 Jan 2024 04:54:03 +0000
(13:54 +0900)
Change-Id: I0f76f2f6f916a8c48ef483ddbd4008b3db920093
Signed-off-by: Jihoon Kim <jihoon48.kim@samsung.com>
packaging/libevdev.spec
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diff --git
a/packaging/libevdev.spec
b/packaging/libevdev.spec
index 1f1729e9bf4fdf6fce1ea774d35dff8ebcc63bdf..f42f19f2298e64ab58526c2ead1d5d75654330d0 100644
(file)
--- a/
packaging/libevdev.spec
+++ b/
packaging/libevdev.spec
@@
-1,5
+1,5
@@
Name: libevdev
-Version: 1.1
1
.0
+Version: 1.1
3
.0
Release: 0
License: MIT
Summary: wrapper library for evdev input devices