packing: Bump up to 1.3.1 submit/tizen/20220208.095446 submit/tizen/20220209.072019 submit/tizen/20220211.041833
authorDuna Oh <duna.oh@samsung.com>
Mon, 7 Feb 2022 16:32:57 +0000 (01:32 +0900)
committerDuna Oh <duna.oh@samsung.com>
Mon, 7 Feb 2022 16:32:57 +0000 (01:32 +0900)
packaging/libxkbcommon.spec

index 186a061..b0d5af0 100644 (file)
@@ -1,5 +1,5 @@
 Name:           libxkbcommon
-Version:        1.0.3
+Version:        1.3.1
 Release:        0
 License:        MIT
 Summary:        Wayland libxkbcommon library