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packaging: bump version to v0.24.0 77/271277/1
authorAdrian Szyndela <adrian.s@samsung.com>
Thu, 17 Feb 2022 12:08:43 +0000 (13:08 +0100)
committerAdrian Szyndela <adrian.s@samsung.com>
Thu, 17 Feb 2022 15:09:08 +0000 (16:09 +0100)
Change-Id: Ifc55899f22eb3ae9e0b5b76e8eb41d15d19110e7

packaging/bcc-tools.spec patch | blob | history

diff --git a/packaging/bcc-tools.spec b/packaging/bcc-tools.spec
index 11ae0c4ba30ae41208c49d4aafa25467c928ef63..f7d4dea696917778309b531e537c0f0ba7925536 100644 (file)
--- a/packaging/bcc-tools.spec
+++ b/packaging/bcc-tools.spec
@@ -1,5 +1,5 @@
 Name: bcc-tools
-Version: 0.21.0
+Version: 0.24.0
 Release: 0
 Summary: Tools for BPF-based Linux IO analysis, networking, monitoring
 License: Apache-2.0
Domain: System / System Framework;