build: package version up (2.0.1)

Change-Id: I9ea7ba4297541cf1d9e59afc4a8c31e8a2e1cbfe
Signed-off-by: Jinhyung Choi <jinhyung2.choi@samsung.com>

diff --git a/package/changelog b/package/changelog
index c1728d7b8a5875cbb3bca3d5893c56874099b616..0c6b0a5df07736b7165dfa52f7ae5acc3acd15f1 100644 (file)
--- a/package/changelog
+++ b/package/changelog
@@ -1,3 +1,9 @@
+* 2.0.1
+- sensors: re-structure with input_event
+- maru_haptic: force feedback driver is added
+- jack & power driver: MAX buf size to 512
+- evdi: added guest emuld connection message
+== Jinhyung Choi <jinhyung2.choi@samsung.com> 2014-06-20
 * 2.0.0
 - Major package version up
 == SeokYeon Hwang <syeon.hwang@samsung.com> 2014-06-10

diff --git a/package/pkginfo.manifest b/package/pkginfo.manifest
index dad5a47415a4dd22185351b1a6be585c036f8731..38b744ee58b0f18b6be480c81906c2ed8ac22bff 100644 (file)
--- a/package/pkginfo.manifest
+++ b/package/pkginfo.manifest
@@ -1,4 +1,4 @@
-Version: 2.0.0
+Version: 2.0.1
 Maintainer: Yeong-Kyoon, Lee <yeongkyoon.lee@samsung.com>
 Source: emulator-kernel