Written by Amit Daniel Kachhap <amit.kachhap@linaro.org>
-Updated: 12 May 2012
+Updated: 6 Jan 2015
Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
clip_cpus: cpumask of cpus where the frequency constraints will happen.
-1.1.2 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
+1.1.2 struct thermal_cooling_device *of_cpufreq_cooling_register(
+ struct device_node *np, const struct cpumask *clip_cpus)
+
+ This interface function registers the cpufreq cooling device with
+ the name "thermal-cpufreq-%x" linking it with a device tree node, in
+ order to bind it via the thermal DT code. This api can support multiple
+ instances of cpufreq cooling devices.
+
+ np: pointer to the cooling device device tree node
+ clip_cpus: cpumask of cpus where the frequency constraints will happen.
+
+1.1.3 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
This interface function unregisters the "thermal-cpufreq-%x" cooling device.