[TCSACR-298] Add new feature key to opengles.surfaceless_context 98/234798/2
authorSunghyun Kim <scholb.kim@samsung.com>
Fri, 29 May 2020 02:04:48 +0000 (11:04 +0900)
committerSunghyun Kim <scholb.kim@samsung.com>
Fri, 29 May 2020 02:15:44 +0000 (11:15 +0900)
Change-Id: I64b827173ca463866ad5ba960b30eb95a73a5831

packaging/platform-preset-boards-rpi3.inc

index a90f6d98dc545c8a1155c8b9b027a749f002ed42..75608dd786af1695152540eb057c5a6bbb260b57 100644 (file)
@@ -399,6 +399,8 @@ Requires:   dali-toolkit-resources_720x1280
 %description sub2-Preset_boards-RPI3-DALi
 Packages of DALi HAL and Feature for RPI3.
 %files sub2-Preset_boards-RPI3-DALi
+%posttrans sub2-Preset_boards-RPI3-DALi
+%tizen_feature tizen.org/feature/opengles.surfaceless_context true
 
 ### RPI3-EFL ###
 %package sub2-Preset_boards-RPI3-EFL