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packaging: enable building for aarch64 38/271438/1
authorAdrian Szyndela <adrian.s@samsung.com>
Fri, 18 Feb 2022 13:02:53 +0000 (14:02 +0100)
committerAdrian Szyndela <adrian.s@samsung.com>
Mon, 21 Feb 2022 08:41:16 +0000 (09:41 +0100)
Change-Id: Id8c602cb897c3223ee863d4d81d6f402f73ae188

packaging/bcc-tools.spec patch | blob | history

diff --git a/packaging/bcc-tools.spec b/packaging/bcc-tools.spec
index f7d4dea696917778309b531e537c0f0ba7925536..313779fe99dc10f102f4ebb0f7209010e355af60 100644 (file)
--- a/packaging/bcc-tools.spec
+++ b/packaging/bcc-tools.spec
@@ -7,7 +7,6 @@ Vendor: None (open source)
 Group: Development/Compilers
 URL: https://github.com/iovisor/bcc
 Source0: %{name}-%{version}.tar.gz
-ExcludeArch: aarch64
 Requires: /sbin/ldconfig
 BuildRequires: gcc >= 3.4
 BuildRequires: cmake python3
Domain: System / System Framework;