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packaging: Bump up to 1.13.3
accepted/tizen_unified
accepted/tizen_unified_x
accepted/tizen/unified/20250224.161828
accepted/tizen/unified/x/20250226.020401
author
duna.oh
<duna.oh@samsung.com>
Thu, 20 Feb 2025 04:08:41 +0000
(13:08 +0900)
committer
duna.oh
<duna.oh@samsung.com>
Thu, 20 Feb 2025 04:08:41 +0000
(13:08 +0900)
packaging/libevdev.spec
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diff --git
a/packaging/libevdev.spec
b/packaging/libevdev.spec
index 4d47a930383e9538894f2a36a6aa1dac4635bfd0..d6ed6c2300c717d471319c65562ba9f74fd89f82 100644
(file)
--- a/
packaging/libevdev.spec
+++ b/
packaging/libevdev.spec
@@
-1,5
+1,5
@@
Name: libevdev
-Version: 1.13.
1
+Version: 1.13.
3
Release: 0
License: MIT
Summary: wrapper library for evdev input devices