packaging: Bump up to 1.10.0
authorjeon <jhyuni.kang@samsung.com>
Wed, 6 Jan 2021 07:00:34 +0000 (16:00 +0900)
committerDuna Oh <duna.oh@samsung.com>
Mon, 7 Feb 2022 16:55:14 +0000 (01:55 +0900)
packaging/libevdev.spec

index c6bd55a0c7ba3bdc8d7d1e1f35bc87c297ef4f00..e96bc877e3d5d801eb08baaa7665cb2fcdf642ea 100644 (file)
@@ -1,5 +1,5 @@
 Name:           libevdev
-Version:        1.8.0
+Version:        1.10.0
 Release:        0
 License:        MIT
 Summary:        wrapper library for evdev input devices