thermal/x86_pkg_temp_thermal: Support multi-die/package

Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.

Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose
multiple zones per package, instead of just one.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com

diff --git a/drivers/thermal/intel/x86_pkg_temp_thermal.c b/drivers/thermal/intel/x86_pkg_temp_thermal.c
index 1ef937d..405b385 100644 (file)
--- a/drivers/thermal/intel/x86_pkg_temp_thermal.c
+++ b/drivers/thermal/intel/x86_pkg_temp_thermal.c
@@ -122,7 +122,7 @@ err_out:
  */
 static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
 {
-       int pkgid = topology_logical_package_id(cpu);
+       int pkgid = topology_logical_die_id(cpu);
 
        if (pkgid >= 0 && pkgid < max_packages)
                return packages[pkgid];
@@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)
 
 static int pkg_temp_thermal_device_add(unsigned int cpu)
 {
-       int pkgid = topology_logical_package_id(cpu);
+       int pkgid = topology_logical_die_id(cpu);
        u32 tj_max, eax, ebx, ecx, edx;
        struct pkg_device *pkgdev;
        int thres_count, err;
@@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
         * worker will see the package anymore.
         */
        if (lastcpu) {
-               packages[topology_logical_package_id(cpu)] = NULL;
+               packages[topology_logical_die_id(cpu)] = NULL;
                /* After this point nothing touches the MSR anymore. */
                wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
                      pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
@@ -515,7 +515,7 @@ static int __init pkg_temp_thermal_init(void)
        if (!x86_match_cpu(pkg_temp_thermal_ids))
                return -ENODEV;
 
-       max_packages = topology_max_packages();
+       max_packages = topology_max_packages() * topology_max_die_per_package();
        packages = kcalloc(max_packages, sizeof(struct pkg_device *),
                           GFP_KERNEL);
        if (!packages)