packaging: add firmware files to fix packaging error 07/163107/1 accepted/tizen/4.0/unified/20171208.061714 accepted/tizen/unified/20171208.062145 submit/tizen/20171207.090727 submit/tizen/20180109.081546 submit/tizen_4.0/20171207.090657
authorSeung-Woo Kim <sw0312.kim@samsung.com>
Thu, 7 Dec 2017 08:01:21 +0000 (17:01 +0900)
committerSeung-Woo Kim <sw0312.kim@samsung.com>
Thu, 7 Dec 2017 08:02:22 +0000 (17:02 +0900)
After new firmware files added from the commit 868e1e44c315 ("rpi3:
update firmware files including extra, cutdown and debug features"),
packaging is failed because no package requires the files. Add the
files into package to fix packaging error.

Change-Id: I8752b8a0f18375c90aee918d489bafe66152264e
Signed-off-by: Seung-Woo Kim <sw0312.kim@samsung.com>
packaging/linux-rpi3-arm64.spec

index 5fdebb965334d9f76ec5a105c5a1e253c71b730f..c3f451af19dae6da1e97eb72ec144dd43b5c0b88 100644 (file)
@@ -131,6 +131,7 @@ rm -rf %{buildroot}
 /boot/bcm*.dtb
 /boot/bootcode.bin
 /boot/config.txt
-/boot/fixup.dat
+/boot/fixup*.dat
 /boot/LICENCE.broadcom
-/boot/start.elf
+/boot/start*.elf
+/boot/README.firmware-type.txt