packaging: apply ASLR 07/268207/2 accepted/tizen/unified/20211219.211407 submit/tizen/20210604.124342 submit/tizen/20210604.131213 submit/tizen/20211217.073219
authorSung-Jin Park <sj76.park@samsung.com>
Fri, 4 Jun 2021 10:48:48 +0000 (19:48 +0900)
committerSung-Jin Park <sj76.park@samsung.com>
Fri, 17 Dec 2021 05:39:10 +0000 (05:39 +0000)
Change-Id: Ia911cc3c62e7cdeff66bf89dd84d36c6d838b329
Signed-off-by: Sung-Jin Park <sj76.park@samsung.com>
packaging/headless-server.spec

index 9913623..89cf51d 100644 (file)
@@ -45,6 +45,8 @@ This package includes developer files common to all packages.
 cp %{SOURCE1001} .
 
 %build
+export CFLAGS+=" -fPIE "
+export LDFLAGS+=" -pie "
 %autogen
 
 make %{?_smp_mflags}