dt-bindings: Document the hi3660 thermal sensor bindings
authorTao Wang <kevin.wangtao@hisilicon.com>
Thu, 22 Jun 2017 03:42:01 +0000 (11:42 +0800)
committerDouglas RAILLARD <douglas.raillard@arm.com>
Tue, 14 Aug 2018 15:32:07 +0000 (16:32 +0100)
This adds documentation of device tree bindings for the
thermal sensor controller of hi3660 SoC.

Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
Documentation/devicetree/bindings/thermal/hi3660-thermal.txt [new file with mode: 0644]

diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
new file mode 100644 (file)
index 0000000..f3dddcf
--- /dev/null
@@ -0,0 +1,16 @@
+* Temperature Sensor on hisilicon hi3660 SoC
+
+** Required properties :
+
+- compatible: "hisilicon,thermal-hi3660".
+- reg: physical base address of thermal sensor and length of memory mapped
+  region.
+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+
+Example :
+
+       tsensor: tsensor {
+               compatible = "hisilicon,thermal-hi3660";
+               reg = <0x0 0xfff30000 0x0 0x1000>;
+               #thermal-sensor-cells = <1>;
+        };