arm64: dts: rockchip: Add idle cooling devices to rk3399
authorDaniel Lezcano <daniel.lezcano@linaro.org>
Fri, 1 Oct 2021 16:17:28 +0000 (18:17 +0200)
committerHeiko Stuebner <heiko@sntech.de>
Wed, 20 Oct 2021 08:00:11 +0000 (10:00 +0200)
The thermal framework accepts now the cpu idle cooling device as an
alternative when the cpufreq cooling device fails.

Add the node in the DT so the cooling devices will be present and the
platforms can extend the thermal zone definition to add them.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20211001161728.1729664-1-daniel.lezcano@linaro.org
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
arch/arm64/boot/dts/rockchip/rk3399.dtsi

index 721bc2b..d3cdf6f 100644 (file)
                        #cooling-cells = <2>; /* min followed by max */
                        dynamic-power-coefficient = <436>;
                        cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+
+                       thermal-idle {
+                               #cooling-cells = <2>;
+                               duration-us = <10000>;
+                               exit-latency-us = <500>;
+                       };
                };
 
                cpu_b1: cpu@101 {
                        #cooling-cells = <2>; /* min followed by max */
                        dynamic-power-coefficient = <436>;
                        cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+
+                       thermal-idle {
+                               #cooling-cells = <2>;
+                               duration-us = <10000>;
+                               exit-latency-us = <500>;
+                       };
                };
 
                idle-states {