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Packaging: version up to 1.18.92
author
Sung-Jin Park
<sj76.park@samsung.com>
Fri, 21 Feb 2020 08:53:36 +0000
(17:53 +0900)
committer
Junkyeong Kim
<jk0430.kim@samsung.com>
Thu, 16 Feb 2023 10:10:50 +0000
(19:10 +0900)
Change-Id: I19174c628d38d91bcb03a9f5e9f8c25adecbf733
Signed-off-by: Sung-Jin Park <sj76.park@samsung.com>
packaging/wayland.spec
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diff --git
a/packaging/wayland.spec
b/packaging/wayland.spec
index
32cd0c0
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e1514f8
100644
(file)
--- a/
packaging/wayland.spec
+++ b/
packaging/wayland.spec
@@
-1,7
+1,7
@@
%define EGL_PACKAGE 1
Name: wayland
-Version: 1.1
7.0
+Version: 1.1
8.92
Release: 0
Summary: Wayland Compositor Infrastructure
License: MIT