[nncc/pkg] Release build for packaging (#9222)
author오형석/On-Device Lab(SR)/Staff Engineer/삼성전자 <hseok82.oh@samsung.com>
Wed, 27 Nov 2019 01:06:17 +0000 (10:06 +0900)
committerGitHub Enterprise <noreply-CODE@samsung.com>
Wed, 27 Nov 2019 01:06:17 +0000 (10:06 +0900)
Use release build for nncc packaging

Signed-off-by: Hyeongseok Oh <hseok82.oh@samsung.com>
infra/packaging/build

index a36d5e2..33c1638 100644 (file)
@@ -87,6 +87,7 @@ REQUIRED_UNITS+=("tf2tflite" "tf2circle")
 # TODO Use "nncc configure" and "nncc build"
 cmake \
   -DCMAKE_INSTALL_PREFIX="${NNCC_INSTALL_PREFIX}" \
+  -DCMAKE_BUILD_TYPE=release \
   -DBUILD_WHITELIST=$(join_by ";" "${REQUIRED_UNITS[@]}") \
   ${EXTRA_OPTIONS[@]} \
   "${NNAS_PROJECT_PATH}/infra/nncc"