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Package version up to 3.1.3
32/307232/2
accepted/tizen/unified/20240307.171841
accepted/tizen/unified/x/20240311.100054
author
Changyeon Lee
<cyeon.lee@samsung.com>
Wed, 6 Mar 2024 07:33:10 +0000
(16:33 +0900)
committer
Changyeon Lee
<cyeon.lee@samsung.com>
Wed, 6 Mar 2024 09:15:32 +0000
(18:15 +0900)
Change-Id: I5a8d0dc0bace0d1692e5caa77d725a79ad7bd1dc
packaging/hal-backend-tbm-vc4.spec
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diff --git
a/packaging/hal-backend-tbm-vc4.spec
b/packaging/hal-backend-tbm-vc4.spec
index e27c6dc8b372a1a41f4f8ebb7a9538d021457434..12c25be54a33adc61116f8e1e6f07a8e9662534d 100644
(file)
--- a/
packaging/hal-backend-tbm-vc4.spec
+++ b/
packaging/hal-backend-tbm-vc4.spec
@@
-1,5
+1,5
@@
Name: hal-backend-tbm-vc4
-Version: 3.1.
2
+Version: 3.1.
3
Release: 1
License: MIT
Summary: hal-backend-tbm module for vc4