bonding: fix multiple module load problem

Some users still load bond module multiple times to create bonding
devices.  This accidentally was broken by a later patch about
the time sysfs was fixed.  According to Jay, it was broken
by:
   commit b8a9787eddb0e4665f31dd1d64584732b2b5d051
   Author: Jay Vosburgh <fubar@us.ibm.com>
   Date:   Fri Jun 13 18:12:04 2008 -0700

     bonding: Allow setting max_bonds to zero

Note: sysfs and procfs still produce WARN() messages when this is done
so the sysfs method is the recommended API.

Signed-off-by: Stephen Hemminger <shemminger@vyatta.com>
Signed-off-by: Jay Vosburgh <fubar@us.ibm.com>
Signed-off-by: David S. Miller <davem@davemloft.net>

diff --git a/drivers/net/bonding/bond_sysfs.c b/drivers/net/bonding/bond_sysfs.c
index 3a1b7b0..5fb861a 100644 (file)
--- a/drivers/net/bonding/bond_sysfs.c
+++ b/drivers/net/bonding/bond_sysfs.c
@@ -1541,6 +1541,7 @@ int bond_create_sysfs(void)
                        printk(KERN_ERR
                               "network device named %s already exists in sysfs",
                               class_attr_bonding_masters.attr.name);
+               ret = 0;
        }
 
        return ret;