Bump to boost 1.71.0 submit/tizen/20191206.003636
authorDongHun Kwak <dh0128.kwak@samsung.com>
Fri, 6 Dec 2019 00:26:45 +0000 (09:26 +0900)
committerDongHun Kwak <dh0128.kwak@samsung.com>
Fri, 6 Dec 2019 00:26:45 +0000 (09:26 +0900)
commitfe19ed710ccbcb970f095af2db7a092a3a1826d4
treee328dde227eef4c783391757052509bcb4c28c2d
parent5ce1cfc2525b06c0a9e38531813781de0281c96d
Bump to boost 1.71.0

Change-Id: Id30e41b0a12e33a049b30ac815966c6327917f85
packaging/baselibs.conf [new file with mode: 0644]
packaging/boost-rpmlintrc [new file with mode: 0644]
packaging/boost.changes [new file with mode: 0644]
packaging/boost.manifest [new file with mode: 0644]
packaging/boost.pc [new file with mode: 0644]
packaging/boost.spec [new file with mode: 0644]
packaging/existing_extra_docs [new file with mode: 0644]
run_test.sh [new file with mode: 0755]