bump up to release 0.28.19 12/291312/1 accepted/tizen_devbase_tools accepted/tizen/devbase/tools/20230414.004436 submit/trunk/20230413.154030
authorbiao716.wang <biao716.wang@samsung.com>
Thu, 13 Apr 2023 07:27:28 +0000 (16:27 +0900)
committerbiao716.wang <biao716.wang@samsung.com>
Thu, 13 Apr 2023 07:27:28 +0000 (16:27 +0900)
commitb2db9550761b5a81ebd8d54b8f4405c22fa8d665
tree97fcb4e711e25f555c9910ae6c63d69b4c329662
parent9a8bc92d498878023dc8bce0798e520aded727f0
bump up to release 0.28.19

Change-Id: Id52b39bb8a0dec06b7563b34392daa6da1cc9c3d
Signed-off-by: biao716.wang <biao716.wang@samsung.com>
ChangeLog
debian/changelog
doc/RELEASE_NOTES
mic/__init__.py
packaging/mic.changes
packaging/mic.spec