bump up to release 0.28.15 23/260823/1 accepted/tizen/devbase/tools/20210707.095507 accepted/tizen/devbase/tools/20210714.004916 submit/trunk/20210707.084530 submit/trunk/20210707.104530 submit/trunk/20210707.124530 submit/trunk/20210713.151030
authorbiao716.wang <biao716.wang@samsung.com>
Tue, 6 Jul 2021 14:37:22 +0000 (23:37 +0900)
committerbiao716.wang <biao716.wang@samsung.com>
Tue, 6 Jul 2021 14:37:22 +0000 (23:37 +0900)
commit4e08567de82cc8a8886705667aaabcf1d7f45bce
tree68ff245b2d5552c0dfa1cb4a970db308eaa44bf4
parent7ade2a5262994fba77e7317a283d85fd3c07e915
bump up to release 0.28.15

Change-Id: I4fb3511f1429ad40b8df27c3e415e44f758342b6
Signed-off-by: biao716.wang <biao716.wang@samsung.com>
ChangeLog
debian/changelog
doc/RELEASE_NOTES
mic/__init__.py
packaging/mic.changes
packaging/mic.spec