packaging: Bump up to 1.5.0 tizen_work_230220 accepted/tizen/unified/20230227.042015
authorduna.oh <duna.oh@samsung.com>
Mon, 20 Feb 2023 14:27:22 +0000 (23:27 +0900)
committerduna.oh <duna.oh@samsung.com>
Mon, 20 Feb 2023 14:27:22 +0000 (23:27 +0900)
commitf91ae46bcbb450bdbc876bbdd3716d2732adaf10
tree2d07e0dde3794906404dfaec0ddb8ccaa9fb2413
parent6b9f332552d5ed84696576bbaa2deaeba3925a39
 packaging: Bump up to 1.5.0

Change-Id: Ifaf29101d3d2f2d8f588aa2c3c36d8462e3b544e
packaging/libxkbcommon.spec