bump up to release 0.28.18 57/286757/1 accepted/tizen/devbase/tools/20230113.003818 submit/trunk/20230112.173030
authorbiao716.wang <biao716.wang@samsung.com>
Thu, 12 Jan 2023 09:37:30 +0000 (18:37 +0900)
committerbiao716.wang <biao716.wang@samsung.com>
Thu, 12 Jan 2023 09:37:30 +0000 (18:37 +0900)
commita6f4890e870644438ca060db8b313c838eb7bbc8
tree6b06b4b84ce88ce49103f2290d69f3483bbf1c5f
parent939fcd62b03b1ed79c0f39d5e3d8fe3a89becaa4
bump up to release 0.28.18

Change-Id: Ia162b5055db14f0c286caa338cf9f863b1490df4
Signed-off-by: biao716.wang <biao716.wang@samsung.com>
ChangeLog
debian/changelog
doc/RELEASE_NOTES
mic/__init__.py
packaging/mic.changes
packaging/mic.spec