Bump to 8.6.13 accepted/tizen_8.0_base accepted/tizen_base accepted/tizen_base_riscv accepted/tizen_base_tool sandbox/tcl_8.6.13 tizen_8.0_base tizen_base accepted/tizen/8.0/base/20231005.045232 accepted/tizen/base/20230714.003534 accepted/tizen/base/riscv/20231110.002703 accepted/tizen/base/tool/20230126.044600 submit/tizen_base/20230111.030409 submit/tizen_base/20230125.075902 tizen_8.0_m2_release
authorTizenOpenSource <tizenopensrc@samsung.com>
Tue, 10 Jan 2023 04:54:52 +0000 (13:54 +0900)
committerTizenOpenSource <tizenopensrc@samsung.com>
Tue, 10 Jan 2023 04:54:52 +0000 (13:54 +0900)
commit8c8d933defd2faa6c86f10ac89cc61bdd7b5b730
tree5dfbb6979ff21f24f2e674577993314d907b8059
parent5baf8e7d556307b67233e391884132078d167b63
Bump to 8.6.13

Signed-off-by: TizenOpenSource <tizenopensrc@samsung.com>
packaging/add_pie_compile_option.patch [new file with mode: 0644]
packaging/baselibs.conf [new file with mode: 0644]
packaging/macros.tcl [new file with mode: 0644]
packaging/tcl-rpmlintrc [new file with mode: 0644]
packaging/tcl.manifest [new file with mode: 0644]
packaging/tcl.spec [new file with mode: 0644]