Merge "remove bonded device from glist" into tizen accepted/tizen_3.0.2014.q3_common accepted/tizen_3.0.m14.3_ivi tizen_3.0.2014.q3_common tizen_3.0.m14.3_ivi accepted/tizen/3.0.2014.q3/common/20141027.140548 accepted/tizen/3.0.m14.3/ivi/20141027.134150 accepted/tizen/common/20141027.101149 submit/tizen/20141027.023732 submit/tizen_3.0.2014.q3_common/20141027.140426 submit/tizen_3.0.m14.3_ivi/20141027.073643 tizen_3.0.2014.q3_common_release tizen_3.0.m14.3_ivi_release
authorwu zheng <wu.zheng@intel.com>
Mon, 27 Oct 2014 02:22:59 +0000 (19:22 -0700)
committerGerrit Code Review <gerrit@review.vlan103.tizen.org>
Mon, 27 Oct 2014 02:22:59 +0000 (19:22 -0700)
commitf9fcfc96cb7f0c96df9602d4b7a724fb289afa78
treeec9de7350a989abb35ecff859a18f6168277241f
parentc944a9e0d3e63ce11f03d0ff5be084ddcf8b4ea4
parent7dc909e5e97bd73a3d613c455ca73e56acb982f3
Merge "remove bonded device from glist" into tizen