Package version up to 3.1.1 63/315963/1 accepted/tizen_unified accepted/tizen_unified_dev tizen accepted/tizen/unified/20240820.163540 accepted/tizen/unified/dev/20240821.053405
authorChangyeon Lee <cyeon.lee@samsung.com>
Wed, 7 Aug 2024 11:30:46 +0000 (20:30 +0900)
committerChangyeon Lee <cyeon.lee@samsung.com>
Mon, 12 Aug 2024 04:52:55 +0000 (13:52 +0900)
commit986c5ee4eff9be372bce7521b8ec35a906f209cf
tree00e032123bf2efe349973e8ddc78c8370b69ea7d
parentcfd184df4462845f90a0459f25243dd7524578aa
Package version up to 3.1.1

Change-Id: I1b370792cfb267c87b6f66dd012b63880fad1df9
packaging/hal-backend-tdm-exynos.spec