Package version up to 3.1.0 40/315040/2 tizen
authorChangyeon Lee <cyeon.lee@samsung.com>
Wed, 24 Jul 2024 03:21:49 +0000 (12:21 +0900)
committerChangyeon Lee <cyeon.lee@samsung.com>
Wed, 24 Jul 2024 06:26:33 +0000 (15:26 +0900)
commit729010f4ad634db29ddb354cfa05e4479601869a
tree7b819829f5d3c1ae4e499a6fd4ef471d0ff1a7a2
parent5981da53d2716489be3b7b31141b5102cb061f57
Package version up to 3.1.0

Change-Id: If210b0a4f2e682b344318c0a277e2ed2cbbd1595
packaging/hal-backend-tdm-nexell.spec