packaging: bump to 2.13.4 accepted/tizen_base_riscv sandbox/playchang/riscv64 tizen_base_dev accepted/tizen/base/riscv/20230717.014329 accepted/tizen/base/riscv/20231130.004946
authorŁukasz Stelmach <l.stelmach@samsung.com>
Mon, 19 Sep 2022 20:03:29 +0000 (22:03 +0200)
committerwchang kim <wchang.kim@samsung.com>
Fri, 14 Jul 2023 03:05:29 +0000 (12:05 +0900)
commitf5f52371752b71e7dcbcd09ed6f31c271c161f8f
tree21bbc189f2f984092716efa143a307ef32b8ad18
parentc5d626dbfe96b596c8b6ecce93e54f21d8964d90
packaging: bump to 2.13.4

Change-Id: I1e6334d59253bec41c64ca4be36d7797cd7bfdac
Signed-off-by: Łukasz Stelmach <l.stelmach@samsung.com>
packaging/lttng-ust.spec