Bump to attr 2.4.48 87/243187/3 accepted/tizen_6.5_base accepted/tizen_6.5_base_tool sandbox/backup/attr-2.4.48-20211110 sandbox/dh0128.kwak/attr_2.4.48_20200904 tizen_6.5_base accepted/tizen/6.5/base/20230714.002414 accepted/tizen/6.5/base/tool/20211027.112536 accepted/tizen/base/tool/20201219.095617 submit/tizen_6.5_base/20211026.180901 submit/tizen_6.5_base/20211027.183101 submit/tizen_6.5_base/20211027.200501 submit/tizen_base/20201112.015012 submit/tizen_base/20201123.011037 submit/tizen_base/20201130.233154 submit/tizen_base/20201207.055733 submit/tizen_base/20201209.232314 submit/tizen_base/20201210.014645 submit/tizen_base/20201214.055650 tizen_6.5.m2_release
authorDongHun Kwak <dh0128.kwak@samsung.com>
Fri, 10 Jan 2020 02:32:49 +0000 (11:32 +0900)
committerDongHun Kwak <dh0128.kwak@samsung.com>
Mon, 7 Sep 2020 00:14:52 +0000 (17:14 -0700)
commit5d558f40938e3488a326c6872402c39288f32796
tree5288dc9cbc08ab31abbf9612c775708b85c515bd
parent6054ea7cfe15a948746fcc51071dc5e6b5c7c4d2
Bump to attr 2.4.48

Change-Id: I51aa9659eb66623c7cae1f77ea572ef6153b9e01
Signed-off-by: DongHun Kwak <dh0128.kwak@samsung.com>
packaging/attr.manifest [new file with mode: 0644]
packaging/attr.spec [new file with mode: 0644]
packaging/baselibs.conf [new file with mode: 0644]
tools/Makemodule.am