Rest e17-data SMACK label to floor and move manifest to packaging 96/11396/2 accepted/tizen/generic accepted/tizen/ivi accepted/tizen/mobile accepted/tizen/20131031.112544 accepted/tizen/20131031.171900 accepted/tizen/20131112.015111 accepted/tizen/generic/20140106.150428 accepted/tizen/ivi/20131219.023546 submit/tizen/20131031.071257 submit/tizen/20131219.022238
authorChengwei Yang <chengwei.yang@intel.com>
Sun, 27 Oct 2013 02:11:59 +0000 (10:11 +0800)
committerChengwei Yang <chengwei.yang@intel.com>
Sun, 27 Oct 2013 02:11:59 +0000 (10:11 +0800)
commit9bda15f306b39c61376a632cc8e94740b8041128
tree60b48bcb4a1b66d6626296b9b8259a529c9f271e
parentf36e7829b26f503f0a39175b8e460b4ec217e3c2
Rest e17-data SMACK label to floor and move manifest to packaging

At current stage, very early in Tizen 3.0, we're resetting all the
packages SMACK label to floor, and will redefine them.

In another hand, SMACK .mainfest is part of packaging now, so move them
into packaging directory.

Change-Id: Ida346c69be9ba012984d0b10b2882325663e417b
Signed-off-by: Chengwei Yang <chengwei.yang@intel.com>
e17-data.manifest [deleted file]
packaging/e17-data.manifest [new file with mode: 0644]
packaging/e17.manifest [moved from e17.manifest with 100% similarity]
packaging/e17.spec