Bump to ed 1.17 71/265471/1 sandbox/dh0128.kwak/ed-1.17-20211020 accepted/tizen/base/20211115.010552 submit/tizen_base/20211111.011859
authorDongHun Kwak <dh0128.kwak@samsung.com>
Wed, 20 Oct 2021 07:19:18 +0000 (16:19 +0900)
committerDongHun Kwak <dh0128.kwak@samsung.com>
Wed, 20 Oct 2021 07:19:47 +0000 (16:19 +0900)
commit08222e150d9f874dd6d197df907cbed3f7bf48e0
treebe32be98a1ee62ebbb4b947cacaf33d31c4ed685
parent41bcecd03c0462a6b5a59c820ce573b1f5dff2c3
Bump to ed 1.17

Change-Id: I8ffe99ddb2aa26defb853b69956a30a6422a78a9
Signed-off-by: DongHun Kwak <dh0128.kwak@samsung.com>
packaging/ed.manifest [new file with mode: 0644]
packaging/ed.spec [new file with mode: 0644]