packaging: removed code associated with module build 32/115032/2
authorJaechul Lee <jcsing.lee@samsung.com>
Thu, 16 Feb 2017 05:42:28 +0000 (14:42 +0900)
committerJaechul Lee <jcsing.lee@samsung.com>
Thu, 16 Feb 2017 07:15:20 +0000 (16:15 +0900)
commit8b2ea22de92249b7bec38b7042f46c75617ad202
tree79df14772b31ae5899d83fca1f680340679995e2
parent9cd9813c7fcf9db0e2687eac84b4b3bf7632febf
packaging: removed code associated with module build

It is not need to build kernel modules, we don't use it.

Change-Id: I534648cf110ae606187a75bca6e49bd9d954eb33
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
packaging/linux-3.18-exynos7270.spec