packaging: Bump to 1.14.1 29/169529/1
authorPhilippe Coval <philippe.coval@open.eurogiciel.org>
Fri, 28 Nov 2014 15:52:19 +0000 (16:52 +0100)
committerWonki Kim <wonki_.kim@samsung.com>
Wed, 7 Feb 2018 08:28:01 +0000 (17:28 +0900)
commitfeffa10a32655d584b8e096b67664e1bbc0610bd
tree1779a0b6ed718306241d11b9476e92d4ee937bf8
parente41c77b87caab385578c63df0f6cbb88b776a708
packaging: Bump to 1.14.1

Bug-Tizen: TC-2003

Change-Id: Icc344617bd56fa20e6a84e3f40da38ac7340afc3
Signed-off-by: Philippe Coval <philippe.coval@open.eurogiciel.org>
packaging/automake.spec