packaging: Bump to 13.1.0
authorSlava Barinov <v.barinov@samsung.com>
Thu, 27 Apr 2023 09:07:41 +0000 (12:07 +0300)
committerSlava Barinov <v.barinov@samsung.com>
Thu, 27 Apr 2023 09:07:41 +0000 (12:07 +0300)
commitfd481b45708b6a7e5406e3ee82365a21c3802b94
treefab10dcce36afcab7610f6e305cd869f556128fd
parenteb0eb844edc452b4ad8570d2a945a0c6ebf9e1dc
packaging: Bump to 13.1.0

Change-Id: I64c7fc98d709773616da57490647f5a1ae0ea53d
packaging/gcc-aarch64.spec
packaging/gcc-armv7hl.spec
packaging/gcc-armv7l.spec
packaging/gcc.spec