Package version up to 3.1.0 43/315043/2 accepted/tizen/unified/20240731.160109 accepted/tizen/unified/dev/20240729.000812
authorChangyeon Lee <cyeon.lee@samsung.com>
Wed, 24 Jul 2024 03:34:37 +0000 (12:34 +0900)
committerChangyeon Lee <cyeon.lee@samsung.com>
Wed, 24 Jul 2024 06:29:51 +0000 (15:29 +0900)
commitfbc8a0165c94ebd06b1de210b92debab1ed3c8bc
treeafc4378ea70d5dae6201a14408c750844b74286c
parent15c3df57ac2406c90a1bc79b8fd4b1fa694dd678
Package version up to 3.1.0

Change-Id: I8f3a67857b8a2fed7a8752cfafec758f686cf7ce
packaging/hal-backend-tdm-exynos.spec