tizen: packaging: support perf build
authorChanho Park <chanho61.park@samsung.com>
Tue, 21 Jan 2014 01:11:34 +0000 (10:11 +0900)
committerMarek Szyprowski <m.szyprowski@samsung.com>
Thu, 15 May 2014 05:27:00 +0000 (07:27 +0200)
commitf556cc03b29ae514d57a8c4206b0ae8a16a68efa
treef869c876c6fe137db57d55919424eb89e9ea86d7
parent65fe332e689424f41f4f3db4dfdb97e6fc3cf641
tizen: packaging: support perf build

Change-Id: Idc375608e3bde344347de6ad37c434b5f16aefbc
Signed-off-by: Chanho Park <chanho61.park@samsung.com>
packaging/linux-kernel.spec