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(parent: 5c82477) | patch
packaging: Made build scripts for GBS.
authorJaechul Lee <jcsing.lee@samsung.com>
Thu, 26 Jan 2017 01:13:24 +0000 (10:13 +0900)
committerSeung-Woo Kim <sw0312.kim@samsung.com>
Wed, 27 Feb 2019 02:11:39 +0000 (11:11 +0900)
commitf48ee98af7cc5c26fec5edfade8bb6ff93b44e32
tree40f93b1d8c9d9ebb6914d6a027411cbb79ec7d6dtree | snapshot
parent5c824776145bf485c3681cad2d26b917f5351857commit | diff
packaging: Made build scripts for GBS.

Build scripts were fixed to be worked on GBS environment based on gcc6.

Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
packaging/linux-3.18-exynos7270.spec diff | blob | history
release_obs.sh diff | blob | history
Domain: System / Kernel; Licenses: GPL-2.0;