packaging: Bump version to 12.2.0
authorDongkyun Son <dongkyun.s@samsung.com>
Wed, 8 Feb 2023 08:17:40 +0000 (17:17 +0900)
committerDongkyun Son <dongkyun.s@samsung.com>
Fri, 28 Jul 2023 12:03:56 +0000 (21:03 +0900)
commitf3e87706f31ef6602c4d907499b3ae9abc424548
tree403b242b7bb240ccd16cc31f4afc9e260807c949
parent0465b3ec771b6554e307e66cdbb636ef81e2f320
packaging: Bump version to 12.2.0

Change-Id: I1e5119b75e065ffd7a27715627de7347d873716f
Signed-off-by: Dongkyun Son <dongkyun.s@samsung.com>
Signed-off-by: Slava Barinov <v.barinov@samsung.com>
packaging/gcc-aarch64.spec
packaging/gcc-armv7hl.spec
packaging/gcc-armv7l.spec
packaging/gcc.spec