packaging: Bump version
authorKarol Lewandowski <k.lewandowsk@samsung.com>
Fri, 24 Jan 2014 15:45:52 +0000 (16:45 +0100)
committerŁukasz Stelmach <l.stelmach@samsung.com>
Wed, 19 Nov 2014 12:46:10 +0000 (13:46 +0100)
commitf07facda2e7ca4cc01b9fd626d7d57ec800a046c
tree62052b6e36b11adf9d7e80182b5bca1bb38a7b32
parent9fc7175a3ed6ea0afeeedaabc01e2ef4cb51e0a4
packaging: Bump version
packaging/kdbus-bus.spec