packaging: Bump release
authorKarol Lewandowski <k.lewandowsk@samsung.com>
Fri, 24 Jan 2014 16:10:52 +0000 (17:10 +0100)
committerŁukasz Stelmach <l.stelmach@samsung.com>
Wed, 19 Nov 2014 12:46:10 +0000 (13:46 +0100)
commitef2f24998287c13806fa35c089431765cd99c615
tree878a632a2a3e8a4d1be0ebd7224447d04cec8860
parentfa0e48970b166c70feb56430b0406fbfd95f362f
packaging: Bump release
packaging/kdbus.spec