packaging: Bump up to 1.8.0
authorJengHyun Kang <jhyuni.kang@samsung.com>
Tue, 24 Oct 2017 07:39:33 +0000 (16:39 +0900)
committerJihoon Kim <jihoon48.kim@samsung.com>
Tue, 4 Feb 2025 09:32:08 +0000 (18:32 +0900)
commitea7c06c903a56f25f81e0d4d63d4a6677c1f97a7
tree4445e7847ec590fcf830a63cd50619444656cd13
parent0e7e9920c44f1d741a74b299e6107db1c98db644
packaging: Bump up to 1.8.0

Change-Id: I4530bc57d1cbc9d9441f95e2e68c944ad7210794
packaging/libinput.spec
src/evdev-fallback.c
src/evdev.c
src/udev-seat.c