packing: Bump up to 1.3.1 submit/tizen/20220208.095446 submit/tizen/20220209.072019 submit/tizen/20220211.041833
authorDuna Oh <duna.oh@samsung.com>
Mon, 7 Feb 2022 16:32:57 +0000 (01:32 +0900)
committerDuna Oh <duna.oh@samsung.com>
Mon, 7 Feb 2022 16:32:57 +0000 (01:32 +0900)
commite57853cd7837961a3b6af29513cab355c04e5bf9
treebb338040ba00be3420d7ca4689842c63ae3d5219
parentf8e32c624594aca8b3544af44d7b0f916b77ab84
packing: Bump up to 1.3.1
packaging/libxkbcommon.spec